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Radio Module accelerates high-end ZigBee development.
Published January 7, 2009, 6:46 pm, ThomasNet
Based on Ember Corporation's EM260 transceiver platform, Apex LT Module runs entire ZigBee(TM) suite of applications and profiles as specified by the ZigBee Alliance. It supports ZigBee and ZigBee Pro Certified software stacks and full mesh networking as well as ZigBee Alliance Smart Energy profile. Occupying 25 x 33 mm footprint, module has integrated antenna, +20 dBm output power, and 4,000+ ...
Energy-harvesting RF chip aims at Mars, Earth
Published January 7, 2009, 4:05 pm, CommsDesign
PORTLAND, Ore. — Energy harvesting radio technology targeted for future Mars missions could make use of a single-chip microtransceiver being developed at Kansas State University.
NASA ISS On-Orbit Status 7 January 2009
Published January 7, 2009, 2:36 pm, SpaceRef
All ISS systems continue to function nominally, except those noted previously or below.
Frost & Sullivan Lauds ITT for the SINCGARS Family of Tactical Radios for Warfighters
Published January 7, 2009, 10:42 am, PR Newswire via Yahoo! Finance
Based on its recent analysis of the Aerospace & Defense market, Frost & Sullivan recognizes ITT Communications Systems with the 2008 North American Frost & Sullivan award for Military Software Defined Radio Growth Strategy Excellence of the Year.
Reliability vs. power in embedded wireless applications--What datasheets don't say
Published January 7, 2009, 8:22 am, Embedded Systems Design
Measuring typical power consumption of the components in use in a system, while the more traditional means of comparing wireless solutions, does not tell the complete story of how well a particular solution minimizes system power consumption. Reliability drives down power consumption. Read on.
Telegent Names Don Stark Vice President of Engineering
Published January 7, 2009, 8:00 am, PR Newswire via Yahoo! Finance
Telegent Systems, the company that makes television mobile with its high-performance single-chip mobile TV solutions, today announced that it has appointed Don Stark as vice president of engineering.
Entropic Communications Introduces Third Generation c.LINK Technology for MoCA Home Networking
Published January 7, 2009, 5:45 am, GlobeNewswire via Yahoo! Finance
LAS VEGAS, Jan. 7, 2009 -- International CES Booth 25829 -- Entropic Communications, Inc. , a leading provider of silicon solutions to enable connected home entertainment, today announced the introduction of its third generation c.LINK solution for MoCA home networking, the EN2510.
Intellon Introduces Third Generation HomePlug AV IC Chipset
Published January 7, 2009, 5:33 am, Centre Daily Times
Intellon Corporation ( Nasdaq : ITLN ), a leading provider of HomePlug®-compatible integrated circuits (ICs) for home networking, networked entertainment, Ethernet-over-Coax (EoC) and smart grid applications, today announced the introduction of its INT6400 HomePlug AV-based powerline chipset. The chipset includes the INT6400 Medium Access Controller and Physical Layer (MAC/PHY) Baseband IC ...
Intellon Introduces Third Generation HomePlug AV IC Chipset
Published January 7, 2009, 5:00 am, Business Wire via Yahoo! Finance
ORLANDO, Fla.----Intellon Corporation , a leading provider of HomePlug®-compatible integrated circuits for home networking, networked entertainment, Ethernet-over-Coax and smart grid applications, today announced the introduction of its INT6400 HomePlug AV-based powerline chipset.
Broadcom Demonstrates 6-Band VDSL2 Chipset Solution Supporting up to VDSL2 Profile 30a at CES 2009
Published January 7, 2009, 5:00 am, PR Newswire via Yahoo! Finance
End Companion Chip Enables High-Speed, Symmetric, 6-band VDSL2 Deployments and VDSL2/ADSL2+ Channel Bonding Applications
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